indie Semiconductor, a renowned Autotech solutions innovator, has launched an exceptional automotive wireless power charging solution that sets a new industry standard. The iND87200, an integrated system-on-chip (SoC), offers the highest level of integration available, streamlining the development of cost-effective in-cabin portable device charging designs based on the Wireless Power Consortium (WPC) Qi 1.3 standard. With the burgeoning demand for in-cabin charging solutions, indie Semiconductor’s latest breakthrough is set to transform the automotive industry.
The Growing Importance of In-Cabin Charging
As drivers and passengers increasingly rely on smartphones for navigation, music, and connectivity while on the move, in-cabin charging has become a necessity. The global semiconductor-enabled in-car automotive wireless charger market is projected to reach a staggering $9.5 billion by 2032, representing a remarkable 22% compound annual growth rate (CAGR) from 2022. Recognizing this trend, indie Semiconductor has developed an innovative solution to cater to the evolving needs of the market.
Advancing Charging Reliability with Qi 2.0 Standard
The iND87200 not only adheres to the existing Qi 1.3 standard but also supports the emerging Qi 2.0 standard, which introduces the Magnetic Power Profile (MPP). This feature enhances ‘on-the-move’ charging reliability by automatically aligning smartphones with an inductive charging coil, regardless of vehicle motion. With Qi 2.0, users can experience faster and more dependable charging, ensuring a seamless in-cabin user experience.
Unparalleled Integration and Cost Efficiency
One of the key advantages of indie Semiconductor’s solution is its unmatched level of integration. The iND87200 SoC significantly reduces external components, simplifying implementation complexity, and minimizing the overall footprint and cost. By nearly halving the external bill-of-materials compared to existing discrete implementations, indie Semiconductor paves the way for faster and cost-effective portable device charging in vehicles across all segments, from feature-rich cars to entry-level vehicles.
Powerful Dual-Core Design
The iND87200 is equipped with a robust dual-core design, combining an Arm Cortex M4F processor with 2MB of embedded Flash and 256kB of SRAM, alongside a dedicated Arm Cortex M0 processor for the WPC stack. This approach optimizes the utilization of SoC compute resources, enabling user-specific software execution without being constrained by timing and interrupt requirements related to the WPC stack. Additionally, indie Semiconductor’s wireless charging solution integrates all the necessary components, including power management, DC-DC converter, signal conditioning, WPC inverter drivers, power FETs, LED, and fan drivers. The SoC also offers multiple connectivity options, such as CAN 2.0B, LIN, I2C, and UARTs, ensuring seamless integration with the vehicle and other peripherals.
Assured Reliability and Time-to-Market
The iND87200 is fully qualified to AEC-Q100 Grade 2 standards, guaranteeing its reliability and performance in automotive environments. The SoC is now in production and being sampled to customers, enabling automotive OEMs to accelerate their development processes. Furthermore, indie Semiconductor goes the extra mile by providing advanced application-oriented reference designs, further expediting customer development and deployment.
Conclusion
indie Semiconductor’s launch of the iND87200 automotive wireless charging solution represents a significant advancement in the field. With unparalleled integration, adherence to industry standards, and advanced features like Qi 2.0 compatibility, indie Semiconductor is set to play a crucial role in shaping the future of in-cabin device charging. Automotive OEMs can rely on indie Semiconductor’s turn-key architecture to deliver faster, cost-effective, and reliable portable device charging, enriching the in-cabin user experience across a wide range of vehicles.
